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July 2008

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Subject:
From:
Leif Erik Laerum <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leif Erik Laerum <[log in to unmask]>
Date:
Wed, 30 Jul 2008 08:29:11 -0500
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Technetters,

We are having an issue with solder fines on our lead free boards. We are
using SAC305 WS and no nitrogen. I noticed that our boards have craters
in the paste on the pads after being printed. Not all pads are deposited
this way, but maybe 25%. These craters have an air bubble in them. The
bubbles usually burst before the boards goes into the P&P, but the
crater stays. The screening process is exactly the same for leaded and
unleaded paste. The leaded paste does not behave this way. Could these
craters be a symptom of the cause of the solder fines? Anyone have any
experience with this?

How do I go about posting pictures to stevezeva.homestead.com?.


--
Leif Erik Laerum
Quality Assurance Manager
Texas Memory Systems
[log in to unmask]
Tel: (713) 266-3200 x468
www.texmemsys.com

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