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July 2008

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Subject:
From:
Brian Chandler <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Chandler <[log in to unmask]>
Date:
Thu, 24 Jul 2008 06:33:24 -0500
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text/plain
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text/plain (18 lines)
Has anyone done any testing to determine if lead free solder causes more
strain to ceramic caps and BGA's? If so, what is the relative difference
compared to SnPb solder?

Regards,

Brian

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