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July 2008

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 2 Jul 2008 06:39:25 -0500
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Hi Grant! Components which use either a  AgPd or a AgPdPt termination 
finish can be problematic at times. Both of these termination finishes 
tend to have short shelf lives in terms of solderability. It is not 
uncommon to only have a 3-6 month solderability shelf life - in comparison 
to many component finishes which have a 12 month solderability shelf life. 
Also, many of the components with a  AgPd or a AgPdPt termination finish 
have a solder-ability concern of leaching the termination finish off the 
component resulting in a loss of solder joint integrity. I wouldn't 
necessarily say that the a  AgPd or a AgPdPt termination finishes are not 
compatible with a Pbfree soldering process but the higher process 
temperatures of SAC soldering processes is going to accelerate the 
leaching of the termination finish so you will have a significantly 
reduced process window in comparison to a tin/lead process. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




Grant Emandien <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
07/02/2008 04:19 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Grant Emandien <[log in to unmask]>


To
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Subject
[TN] Silver-Palladium termination SMT solder problems






Hi all,
 
We are experiencing poor solderability with AgPd-terminations on MOVs
exposed to a lead-free reflow profile using a SAC alloy on an
ENIG-finished PCB. Though we have run this board only once previously
with the same part finish using a lead-rich alloy, we had similar
effects but not to the extent we are now experiencing.
 
Can anyone provide some insight into this/
 
Regards
Grant
 

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