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Date: | Wed, 2 Jul 2008 06:39:25 -0500 |
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Hi Grant! Components which use either a AgPd or a AgPdPt termination
finish can be problematic at times. Both of these termination finishes
tend to have short shelf lives in terms of solderability. It is not
uncommon to only have a 3-6 month solderability shelf life - in comparison
to many component finishes which have a 12 month solderability shelf life.
Also, many of the components with a AgPd or a AgPdPt termination finish
have a solder-ability concern of leaching the termination finish off the
component resulting in a loss of solder joint integrity. I wouldn't
necessarily say that the a AgPd or a AgPdPt termination finishes are not
compatible with a Pbfree soldering process but the higher process
temperatures of SAC soldering processes is going to accelerate the
leaching of the termination finish so you will have a significantly
reduced process window in comparison to a tin/lead process. Good Luck.
Dave Hillman
Rockwell Collins
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Grant Emandien <[log in to unmask]>
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[TN] Silver-Palladium termination SMT solder problems
Hi all,
We are experiencing poor solderability with AgPd-terminations on MOVs
exposed to a lead-free reflow profile using a SAC alloy on an
ENIG-finished PCB. Though we have run this board only once previously
with the same part finish using a lead-rich alloy, we had similar
effects but not to the extent we are now experiencing.
Can anyone provide some insight into this/
Regards
Grant
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