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| Date: | Tue, 22 Jul 2008 18:45:58 -0400 |
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There is an organic material in alternative oxide processes which may be causing the traces to appear tarnished after etch.Scott B. Westheimer5709 Clarks Fork DriveRaleigh, NC [log in to unmask]: (919)713-0748Cell NC: (919)961-5364 > Date: Tue, 22 Jul 2008 14:52:48 -0700> From: [log in to unmask]> Subject: [TN] Cupric & Cobra-Bond question> To: [log in to unmask]> > I have a customer who gets a gold tarnish on copper traces after cupric> etch. It is usually worst with higher weight copper, and looks to be> related to rinsing. The tarnish is not removed in the strip/rinse /dry> process after etch. When the tarnish becomes extreme it effects the> coverage of the Cobra-bond. The alkaline cleaner prior to the Cobra-bond> does not remove the tarnish. I'm trying the maximize the rinsing as much> as possible. I'm also thinking about upping the normality of the cupric> (currently .3). They also etch a lot of boards that been put thru> Cobra-bond to help with the adhesion of the dryfilm. This is a new> process. Would this cause a problem with the cupric? Any thoughts.> Thanks in advance.> > ---------------------------------------------------> Technet Mail List provided as a service by IPC using LISTSERV 15.0> To unsubscribe, send a message to [log in to unmask] with following text in> the BODY (NOT the subject field): SIGNOFF Technet> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest> Search the archives of previous posts at: http://listserv.ipc.org/archives> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815> -----------------------------------------------------
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