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July 2008

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Subject:
From:
Rex Waygood <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rex Waygood <[log in to unmask]>
Date:
Wed, 2 Jul 2008 10:38:38 +0100
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There has been a similar thread on smart-e-link in the last week.
The general consensus was that AgPd terminations are not compatible with
SAC.
Rex


Rex Waygood
Technical Manager
 
PartnerTech Poole Ltd 
Benson Road
Poole
Dorset BH17 0RY
United Kingdom
 
Tel: +44 (0)1202 674333
Fax: +44 (0)1202 678028
DDI: +44 (0)1202 338222
Mob: +44 (0)7887 997403
 
[log in to unmask]
www.PartnerTech.co.uk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Grant Emandien
Sent: 02 July 2008 10:20
To: [log in to unmask]
Subject: [TN] Silver-Palladium termination SMT solder problems

Hi all,
 
We are experiencing poor solderability with AgPd-terminations on MOVs
exposed to a lead-free reflow profile using a SAC alloy on an
ENIG-finished PCB. Though we have run this board only once previously
with the same part finish using a lead-rich alloy, we had similar
effects but not to the extent we are now experiencing.
 
Can anyone provide some insight into this/
 
Regards
Grant
 

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