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July 2008

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Tue, 22 Jul 2008 06:25:44 -0400
Content-Type:
text/plain
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text/plain (82 lines)
Regards,
 
George
George M. Wenge
Amen


Regards,

George
George M. Wenger
Andrew Wireless Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 (office) (732) 309-8964 (cell)
[log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Tuesday, July 22, 2008 6:22 AM
To: [log in to unmask]
Subject: Re: [TN] looking for ENiG photos

Hi,
I fully agre with Ingemar-that is why I cannot recommend ENIG to my
clients.
I have seen problems with little P, 'normal' P and excessive P
concentrations- the latter being the worst.

Werner Engelmaier
Future workshops:
Solder Joint Reliability: Parts 1 through 4, July 21/22, Hamburg,
Germany Pb-Free Soldering Processes-Survival, Quality, Reliability,
August 18, Orlando Reliability Issues with Lead-Free Soldering
Processes, September 22, Schaumburg Failure Mode and Root Cause Analyses
Reliability (Fatigue, Brittle Fracture, ENIG), September 22, Schaumburg
Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia Solder
Joint Reliability: Parts 1 & 4, Oct. 17, Timisoara, Rumania Solder Joint
Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia



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