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July 2008

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Subject:
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Tue, 1 Jul 2008 20:02:20 +0800
Content-Type:
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text/plain (242 lines)
I do agreed different chemicals react differently between them, so far the peelable that we are doing does not react with Solithane 113/113-300. Thank for the advice which is always a point to consider.

________________________________

From: TechNet on behalf of Graham Naisbitt
Sent: Tue 7/1/2008 5:54 PM
To: [log in to unmask]
Subject: Re: [TN] Solithane coating dewetting



Tan

Be careful - peelable masks often contain ingredients that remain 
behind after removal and that can lead to unfavorable reactions.

Graham Naisbitt


On 27 Jun 2008, at 07:46, Tan Geok Ang wrote:

> Currently, I will apply some peelable mask over those "problematic" IC
> moulding, the dewetting is minimised. Just want to find out the 
> cause of
> the problem. Thank for the advice!
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
> (EHCOE)
> Sent: Thursday, 26 June 2008 10:10 PM
> To: [log in to unmask]
> Subject: Re: [TN] Solithane coating dewetting
>
> I agree with Doug, especially the part about somewhat agreeing with
> Graham (just kidding). Since these are the daze of outsourcing, I have
> had to give relief on the coverage requirement for non-conductive,
> non-critical surface areas of plastic parts due to the aforementioned
> reasons.
> Dewey
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
> Sent: Thursday, June 26, 2008 5:30 AM
> To: [log in to unmask]
> Subject: Re: [TN] Solithane coating dewetting
>
> I somewhat agree with Graham.  Nothing really likes to stick to
> silicones,
> including other silicones.  I often have to address the challenge of
> conformal coating delaminating over a spot where RTV silicones had 
> been
> dripped and then wiped up.
>
> I would suggest plasma etching, most likely oxygen and argon.  A 
> fairly
> short duration is often effective at solving coating adhesion issues 
> in
> problem cases.   Many of the mold release agents are either teflon or
> silicone based, so will be fairly chemically resistant.  That is why 
> the
>
> Ensolv may not be addressing it.
>
> Where I disagree with Graham is the approach of having the component
> manufacturer change their most release agent. If you are a Motorola 
> or a
>
> Nokia, and going through a few million components a day, you might 
> have
> a
> little leverage with the component manufacturer.  Most of us just have
> to
> take what we can get and don't have the leverage necessary to get
> changes
> made.
>
> Doug Pauls
> Rockwell Collins
>
>
>
>
> Graham Naisbitt <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 06/26/2008 06:05 AM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> Graham Naisbitt <[log in to unmask]>
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> Re: [TN] Solithane coating dewetting
>
>
>
>
>
>
> Silicone not sticking to silicone - no surprise.
>
> How to remove silicone? Not easy, maybe plasma etching or a really
> aggressive solvent.
>
> You need to get back to the component manufacturer and have them
> change their mold release or at least control how much they use.
>
> Graham Naisbitt
>
> On 26 Jun 2008, at 07:33, Tan Geok Ang wrote:
>
>> Hi All,
>>               Quite often, I encountered Solithane coating dewetting
> issue
>> over some IC moulding (rough or smooth, did not trace what moulding
>> material is used) compounds across different suppliers, though the
>> whole
>> PCBAs are being cleaned with EnSolv. What is the cause of the issue?
>> Is
>> the cause due to the release agent used during the moulding compound
>> process (but why cannot be clean away)?
>>               Thank in advance!
>> Regards
>> GA Tan
>>
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