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July 2008

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From:
- bogert <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, - bogert <[log in to unmask]>
Date:
Thu, 17 Jul 2008 18:20:44 -0400
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July 17, 2008

J-STD-001D, paragraph 8.3.6 requires that, if cleanliness testing is
mandated, the testing must be performed after final cleaning (i.e., prior to
conformal coating). We have an OEM who performs cleaning within 1/2 hour
after wave soldering. The OEM also does post hand soldering after wave
soldering and does local cleaning of the hand soldered joints in max 1/2
hour after soldering. However, several days or weeks may pass between the
wave soldering and hand soldering operations before conformal coating is
done. The OEM does the cleanliness test just prior to conformal coating as
is mandated by J-STD-001 since the cleaning after hand soldering is the
"final cleaning operation".

My question is since the cleanliness test is not done until several weeks
after wave soldering/post wave soldering cleaning was done, will the ionic
cleanliness testing mandated by J-STD-001 (standard instrument test like
Omegameter) be caple of detecting ionic contamination?

Seems to me that if the cleaning process is having problems, harmful Type M
or H flux residue, if not completely removed by the cleaning process, may
solidify to the extent that the DI water/Alcohol cleanliness test may not be
capable of dissolving the hardened residue precluding detecting ionic
contamination. Is this a valid concern or not? Is there any data that
shows the ability of the test equipment to detect ionic residue over time
since cleaning? Do we need to make any changes to J-STD-001, paragraph
8.3.6 based on my question? If so, please propose recommended wording for
the change. Thanks for your support.

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