Hi,

If cleaning is good and complete, the reliability of the cleaned assemblies
should be better than any no -clean under the normal operation environment
of assemblies.

If finding any things growth on the cleaned board, it may have two
possbilities

1. the cleaning is not good

2. Condensation occurs on the test board inside the chamber

If you have the SIR reading for SC10 alone, it does not indicate the
cleanability of this solvent for all type of residues.  The cleaning
process involves:

Solvent

cleaning method

parameters

board / component configuration / solder mask effect

All above factors should be considered as whole

Jackson Chan
Technical Services Manager
Cookson Electronics - Alpha Metals (Hong Kong)

Low cost, high reliable alloy - SACX0807