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July 2008

TGAsia@IPC.ORG

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Subject:
From:
Yuet Shan Chan <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Yuet Shan Chan <[log in to unmask]>
Date:
Fri, 25 Jul 2008 16:09:44 +0800
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IPC-4552:  Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards.

>>> [log in to unmask] 07/25/08 4:03 PM >>>
Dear Friend,
Did IPC indicate that immersion gold thickness have to be minimum 2u" gold?  This 2u" thickness is referring to the gold thickness only or it is the total thickness which includes the nickel too? Which IPC documents indicates this?
Hope to have your expertise advise.
Thanks & Best Regards
Patricia Lui
Xuan Technology LLP.
email: [log in to unmask] 


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