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July 2008

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Sun, 20 Jul 2008 16:02:18 -0400
Content-Type:
text/plain
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text/plain (82 lines)
Werner,
If you read my paper "Tin Pest - A review", IPC Works 2006, you will see
that there is clear evidence that tin pest had nothing to do with
Napoleon's defeat in Russia.
Bev
RIM

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
/*
Sent: Sunday, July 20, 2008 3:06 PM
To: [log in to unmask]
Subject: Re: [LF] Tin Pest Caught in the Act

Hi Keith,
I certainly, would not subscribe to the "the sky is falling" view on
Pb-free-
more the "the money is disappearing" view, as far as solder joints are 
concerned, but it is much worse for PCBs and components--and so totally
unnecessary, 
actually damaging to the environment.
While tin pest is an actuality, from the anectotal reason of the defeat
of 
Napoleon's army because their trousers dropped with powderized uniform
buttons, 
to the multi-million Euro air conditiong reqired for the Viennese 
Kapuzinergruft to preserve the royal tin sarcophagi, I do not see any
real threat for 
electronics.
The proper, perhaps improper, environments do not typically exist, and
100 
ppm Pb would even solve that reote eventuality.

Werner Engelmaier
Future workshops:
Solder Joint Reliability: Parts 1 through 4, July 21/22, Hamburg,
Germany
Pb-Free Soldering Processes-Survival, Quality, Reliability, August 18, 
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22, 
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle
Fracture, 
ENIG), September 22, Schaumburg
Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia
Solder Joint Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia



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