TECHNET Archives

July 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Graham Naisbitt <[log in to unmask]>
Date:
Tue, 1 Jul 2008 16:36:27 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (268 lines)
Tan

It is not a reaction with the Solithane coating that I would worry  
about, it is the possibly harmful effects from the residues of the  
mask on the actual circuit performance - exacerbated by the presence  
of a hydrophilic coating.

Graham Naisbitt

On 1 Jul 2008, at 13:02, Tan Geok Ang wrote:

> I do agreed different chemicals react differently between them, so  
> far the peelable that we are doing does not react with Solithane  
> 113/113-300. Thank for the advice which is always a point to consider.
>
> ________________________________
>
> From: TechNet on behalf of Graham Naisbitt
> Sent: Tue 7/1/2008 5:54 PM
> To: [log in to unmask]
> Subject: Re: [TN] Solithane coating dewetting
>
>
>
> Tan
>
> Be careful - peelable masks often contain ingredients that remain
> behind after removal and that can lead to unfavorable reactions.
>
> Graham Naisbitt
>
>
> On 27 Jun 2008, at 07:46, Tan Geok Ang wrote:
>
>> Currently, I will apply some peelable mask over those "problematic"  
>> IC
>> moulding, the dewetting is minimised. Just want to find out the
>> cause of
>> the problem. Thank for the advice!
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
>> (EHCOE)
>> Sent: Thursday, 26 June 2008 10:10 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] Solithane coating dewetting
>>
>> I agree with Doug, especially the part about somewhat agreeing with
>> Graham (just kidding). Since these are the daze of outsourcing, I  
>> have
>> had to give relief on the coverage requirement for non-conductive,
>> non-critical surface areas of plastic parts due to the aforementioned
>> reasons.
>> Dewey
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
>> Sent: Thursday, June 26, 2008 5:30 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] Solithane coating dewetting
>>
>> I somewhat agree with Graham.  Nothing really likes to stick to
>> silicones,
>> including other silicones.  I often have to address the challenge of
>> conformal coating delaminating over a spot where RTV silicones had
>> been
>> dripped and then wiped up.
>>
>> I would suggest plasma etching, most likely oxygen and argon.  A
>> fairly
>> short duration is often effective at solving coating adhesion issues
>> in
>> problem cases.   Many of the mold release agents are either teflon or
>> silicone based, so will be fairly chemically resistant.  That is why
>> the
>>
>> Ensolv may not be addressing it.
>>
>> Where I disagree with Graham is the approach of having the component
>> manufacturer change their most release agent. If you are a Motorola
>> or a
>>
>> Nokia, and going through a few million components a day, you might
>> have
>> a
>> little leverage with the component manufacturer.  Most of us just  
>> have
>> to
>> take what we can get and don't have the leverage necessary to get
>> changes
>> made.
>>
>> Doug Pauls
>> Rockwell Collins
>>
>>
>>
>>
>> Graham Naisbitt <[log in to unmask]>
>> Sent by: TechNet <[log in to unmask]>
>> 06/26/2008 06:05 AM
>> Please respond to
>> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
>> Graham Naisbitt <[log in to unmask]>
>>
>>
>> To
>> [log in to unmask]
>> cc
>>
>> Subject
>> Re: [TN] Solithane coating dewetting
>>
>>
>>
>>
>>
>>
>> Silicone not sticking to silicone - no surprise.
>>
>> How to remove silicone? Not easy, maybe plasma etching or a really
>> aggressive solvent.
>>
>> You need to get back to the component manufacturer and have them
>> change their mold release or at least control how much they use.
>>
>> Graham Naisbitt
>>
>> On 26 Jun 2008, at 07:33, Tan Geok Ang wrote:
>>
>>> Hi All,
>>>              Quite often, I encountered Solithane coating dewetting
>> issue
>>> over some IC moulding (rough or smooth, did not trace what moulding
>>> material is used) compounds across different suppliers, though the
>>> whole
>>> PCBAs are being cleaned with EnSolv. What is the cause of the issue?
>>> Is
>>> the cause due to the release agent used during the moulding compound
>>> process (but why cannot be clean away)?
>>>              Thank in advance!
>>> Regards
>>> GA Tan
>>>
>>> ---------------------------------------------------
>>> Technet Mail List provided as a service by IPC using LISTSERV 15.0
>>> To unsubscribe, send a message to [log in to unmask] with following
>>> text in
>>> the BODY (NOT the subject field): SIGNOFF Technet
>>> To temporarily halt or (re-start) delivery of Technet send e-mail to
>> [log in to unmask]
>>> : SET Technet NOMAIL or (MAIL)
>>> To receive ONE mailing per day of all the posts: send e-mail to
>> [log in to unmask]
>>> : SET Technet Digest
>>> Search the archives of previous posts at:
>> http://listserv.ipc.org/archives
>>> Please visit IPC web site
>> http://www.ipc.org/contentpage.asp?Pageid=4.3.16
>>> for additional information, or contact Keach Sasamori at
>> [log in to unmask]
>>
>>> or 847-615-7100 ext.2815
>>> -----------------------------------------------------
>>
>> ---------------------------------------------------
>> Technet Mail List provided as a service by IPC using LISTSERV 15.0
>> To unsubscribe, send a message to [log in to unmask] with following  
>> text
>> in
>> the BODY (NOT the subject field): SIGNOFF Technet
>> To temporarily halt or (re-start) delivery of Technet send e-mail to
>> [log in to unmask]: SET Technet NOMAIL or (MAIL)
>> To receive ONE mailing per day of all the posts: send e-mail to
>> [log in to unmask]: SET Technet Digest
>> Search the archives of previous posts at:
>> http://listserv.ipc.org/archives
>> Please visit IPC web site
>> http://www.ipc.org/contentpage.asp?Pageid=4.3.16
>> for additional information, or contact Keach Sasamori at
>> [log in to unmask]
>> or
>> 847-615-7100 ext.2815
>> -----------------------------------------------------
>>
>>
>> ---------------------------------------------------
>> Technet Mail List provided as a service by IPC using LISTSERV 15.0
>> To unsubscribe, send a message to [log in to unmask] with following  
>> text
>> in
>> the BODY (NOT the subject field): SIGNOFF Technet
>> To temporarily halt or (re-start) delivery of Technet send e-mail to
>> [log in to unmask]: SET Technet NOMAIL or (MAIL)
>> To receive ONE mailing per day of all the posts: send e-mail to
>> [log in to unmask]: SET Technet Digest
>> Search the archives of previous posts at:
>> http://listserv.ipc.org/archives
>> Please visit IPC web site
>> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
>> information, or contact Keach Sasamori at [log in to unmask] or
>> 847-615-7100
>> ext.2815
>> -----------------------------------------------------
>>
>> ---------------------------------------------------
>> Technet Mail List provided as a service by IPC using LISTSERV 15.0
>> To unsubscribe, send a message to [log in to unmask] with following  
>> text
>> in
>> the BODY (NOT the subject field): SIGNOFF Technet
>> To temporarily halt or (re-start) delivery of Technet send e-mail to
>> [log in to unmask]: SET Technet NOMAIL or (MAIL)
>> To receive ONE mailing per day of all the posts: send e-mail to
>> [log in to unmask]: SET Technet Digest
>> Search the archives of previous posts at:
>> http://listserv.ipc.org/archives
>> Please visit IPC web site
>> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
>> information, or contact Keach Sasamori at [log in to unmask] or
>> 847-615-7100
>> ext.2815
>> -----------------------------------------------------
>>
>> ---------------------------------------------------
>> Technet Mail List provided as a service by IPC using LISTSERV 15.0
>> To unsubscribe, send a message to [log in to unmask] with following
>> text in
>> the BODY (NOT the subject field): SIGNOFF Technet
>> To temporarily halt or (re-start) delivery of Technet send e-mail  
>> to [log in to unmask]
>> : SET Technet NOMAIL or (MAIL)
>> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]
>> : SET Technet Digest
>> Search the archives of previous posts at: http://listserv.ipc.org/archives
>> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
>> for additional information, or contact Keach Sasamori at [log in to unmask]
>> or 847-615-7100 ext.2815
>> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following  
> text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask] 
> : SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask] 
> : SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
>  for additional information, or contact Keach Sasamori at [log in to unmask] 
>  or 847-615-7100 ext.2815
> -----------------------------------------------------
>
>
> <winmail.dat>

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2