TGASIA Archives

July 2008

TGAsia@IPC.ORG
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Sender:
TGAsia <[log in to unmask]>
X-To:
Asia Committe Task Group Forum <[log in to unmask]>, chchuan <[log in to unmask]>
Date:
Wed, 30 Jul 2008 13:40:03 +0800
Reply-To:
[log in to unmask]
Content-Type:
multipart/related; boundary="----=_NextPart_000_0015_01C8F249.C72F9D60"
Subject:
Re: Via Holes Filled With Solder
From:
Ilkka Lehtinen <[log in to unmask]>
MIME-Version:
1.0
In-Reply-To:
<[log in to unmask]>
Organization:
teleste
Comments:
RFC822 error: <W> MESSAGE-ID field duplicated. Last occurrence was retained.
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