Hi Jackson , Kelvin,
Thank you very much for the clarification in just short period. Really
appreciate that.
Rgds,
Balan
----- Original Message -----
From: "Jackson Chan" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, July 29, 2008 10:37 AM
Subject: Re: [TGA] Lead free alloy
> Hi Balan / Kelvin,
>
> Agreed with Kelvin on what points should be taken when selecting the lead
> free alloy.
>
> In terms of the popluarity, SAC305 / Sn 0.7cu / SN100 C / SACX 0307 gain
> the considerable market share in wavesoldering / dipping application. All
> of them are basically compatiable to SAC alloy.
>
>
>
> Jackson Chan
> Technical Services Manager
> Cookson electronics - Alpha Metals
>
>
>
>
>
>
>
>
>
> "Qualitek"
> <qualitek@qualite
> ksolution.com> To
> "Jackson Chan"
> 2008/07/28 ¤U¤È <[log in to unmask]>
> 11:21 cc
> "Asia Committe Task Group Forum"
> <[log in to unmask]>
> Subject
> Re: [TGA] Lead free alloy
>
>
>
>
>
>
>
>
>
>
> Hi Jackson,
>
> Really appreciate your fast and brief input. I totally agree that there
> should be
> silver content to maintain the SAC characteristic as a whole.
>
> Lately, what puzzle is the Nickel(SN100C) content which being understood
> which may
> contribute closer to SACX0807 compare to Tin/Cu.
>
> Another plus point is Nickel content composition being claimed to be
> substitude alloy to
> be soldered with SAC alloy as an alternative. (esp. Paste is SAC305 but
> Solder wire possible with
> SN100C rather than even SACX due to its popularity of qualified to use as
> a
>
> combination alloy with
> SAC305)
>
> So, in short what would be best explaination for SACX in comparison to
> SN100C.
>
> Thank you sir.
>
> Rgds,
> Balan
>
>
>
> ----- Original Message -----
> From: "Jackson Chan" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Monday, July 28, 2008 11:28 AM
> Subject: Re: [TGA] Lead free alloy
>
>
>> Hi Balan,
>>
>>
>> There is, at least, three factors when finding the right choice of alloy
>> for the particular application and product requirement
>>
>> 1. Cost
>>
>> 2. Performance (e.g. hole-fill at wavesoldering process)
>>
>> 3. Reliability (Thermal cycle, drop shock etc)
>>
>>
>> Just in terms of raw material cost, tin / copper alloy should be the
>> cheapest one. The addition of silver would add the cost. However, it is
>> not the "only" criteria when selecting the alloy as indicated above.
>>
>> High silver alloy is proved to have the good reliability in terms of
>> thermal cycle test comparing to tin / copper alloy. However, the cost is
>> considerable. As a result, certain balance point when considering the
>> above three factors as a whole. Therefore, the silver content is needed
>> to
>> lower but still satisfy the performance and reliability requirement.
>> SACX0807 (Silver 0.8%, 0.7% copper) is one of the choice when considering
>> the product which is needed to meet these factors
>>
>> Jackson Chan
>> Technical Services Manager
>> Cookson electronics - Alpha Metals
>>
>> Low cost, reliable alloy- SACX0807
>>
>>
>>
>>
>> "Qualitek"
>> <qualitek@qualite
>> ksolution.com> To
>> "Asia Committe Task Group Forum"
>> 2008/07/27 ¤U¤È <[log in to unmask]>, "Jackson Chan"
>> 10:01 <[log in to unmask]>
>> cc
>>
>> Subject
>> Re: [TGA] Immersion gold thickness
>> enquiry
>>
>>
>>
>>
>>
>>
>>
>>
>>
>>
>> Hi Jackson,
>>
>> Using SACX0807, will this become best choice to replace SN100C in terms
>> of
>> both
>> 1)Pricing
>> 2)Joint finishing compare to SAC305
>>
>> Appreciate your sharing on the above matter.
>>
>> Rgds,
>> Balan
>>
>>
>>
>>
>>
>>
>
>
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