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Subject:	Re: Chip on Board and Solder Mask
From:	Werner Engelmaier /* <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Thu, 5 Jun 2008 15:36:11 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (40 lines)

Hi Ben,
For the components for which the question was posed, you do not need 
underfill.
Underfill have the function to put the solder joints of larger components 
under compression, thereby imcresing fatigue life as well as not showing 
functional failures even if SJs are fractured.



Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, June 17, London
Interconnect Failures and Design for Reliability for PCB PTHs, June 17, 
London
Solder Joint Reliability: Parts 1 through 4, July 17/18, Thal, Switzerland
Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18, 
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22, 
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, 
ENIG), September 22, Schaumburg



**************
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Tyler Florence" on AOL Food.
      (http://food.aol.com/tyler-florence?video=4?&amp;
NCID=aolfod00030000000002)

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