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Subject:	Re: Chip on Board and Solder Mask
From:	Werner Engelmaier /* <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Thu, 5 Jun 2008 09:17:27 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (38 lines)

Hi Ben,
The solder mask will automatically be thinner then the resulting joint 
height, because the CTE of the solder mask is greater than the CTE of the solder, 
and therefore wil shrink more on cooling from soldering temperatures. 
Having a soldermask under the component is agood thing, because it will 
increase the resulting joint height thereby increasing reliability.

Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, June 17, London
Interconnect Failures and Design for Reliability for PCB PTHs, June 17, 
London
Solder Joint Reliability: Parts 1 through 4, July 17/18, Thal, Switzerland
Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18, 
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22, 
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, 
ENIG), September 22, Schaumburg



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