Preparing to Meet Tomorrow's Needs: An IPC Design Conference
June 23-25, 2008, Montreal Quebec Canada

Take advantage of this opportunity, register for both the Design Conference and the Design for Manufacture and Electrical Considerations on Signal Integrity workshop and save!  For additional information please go to www.ipc.org/designconference0608<http://www.ipc.org/designconference0608>.  Don't miss out on this valuable educational opportunity!

We would like to personally encourage you and your colleagues to attend the upcoming IPC Design Conference in Montreal, Quebec Canada. The educational course will be held on June 23-24th with the technical conference to follow on June 25th.

The educational course on June 23-24 will address:


Design for Manufacture and Electrical Considerations on Signal Integrity
Dieter Bergman, IPC and Eric Bogatin, Bogatin Enterprises


As most designers and engineers know, there are many compromises that must be made to bring a new product to the market place. Manufacturability and performance of the product must be considered to please customers and stay profitable. This workshop will identify the critical issues related to both subjects: fabrication and electronic design principles.

These topics will be covered during the technical conference on June 25th:

*                 Design for Manufacture
*                 Metric Pitch BGA
*                 Copper Foils for High Frequency
*                 Impedance Control
*                 High Speed Design Process
*                 High Frequency
*                 Signal Integrity
*                 Embedded Capacitor Technology
*                 Implementing Advanced Technologies

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