TECHNET Archives

June 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Gumpert, Ben" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gumpert, Ben
Date:
Wed, 25 Jun 2008 12:00:40 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (124 lines)
 
Jonathan,

The balls are already attached, this is a component as provided by the
vendor.

Your comments about reliability are what I am looking for, and I am
seeing the same thing that you describe - increased diffusion of the
ball at the SAC/Pb90Sn10 interface when compared to a Sn63Pb37/Pb90Sn10
interface. 

The balls have not reached the point of collapsing, likely because we
subjected them only to a Pb reflow profile.

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of jonathan noquil
Sent: Tuesday, June 24, 2008 11:05 PM
To: [log in to unmask]
Subject: Re: [TN] SAC solder on Pb90Sn10

Hi Ben:
Why not use flux to attach the balls?
If you use solder it could alter somehow your ball diameter and ball
property since SAC solder is Sn rich and your ball is high lead. Pb will
react with Sn and gradually affect the solder joint property between
solderball and SAC solder (This is a reliability risk).
In the past we have tried this and our solder ball collapsed due to Sn
and Pb reaction, but since your BGA solder mask defined, maybe you can
maintain your ball height but i doubt if you can maintain ball
uniformity/planarity

regards
J.Noquil
Senior Member Technical Staff
CSD




On 6/25/08, Stadem, Richard D. <[log in to unmask]> wrote:
>
> Hi, Ben
> Good question. I checked with the Power PC data sheets
> http://ieeexplore.ieee.org/iel3/3906/11336/00514354.pdf?arnumber=51435
> 4 and they do not specify how they attach their 90/10 balls to the 
> package, but I suspect some type of high-temp alloy is used. I do not 
> believe they reflow the balls directly to the package pads. But I 
> never did know what they use to solder the balls to the package with. 
> Let me know if you find out.
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
> Sent: Tuesday, June 24, 2008 12:42 PM
> To: [log in to unmask]
> Subject: [TN] SAC solder on Pb90Sn10
>
> Technetters,
>
> Does anyone have any experience (or heard of) using SAC solder to 
> attach high-temp (Pb90Sn10) solder balls to a ceramic BGA?
>
> Ben
>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0 To 
> unsubscribe, send a message to [log in to unmask] with following text in

> the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt 
> or
> (re-start) delivery of Technet send e-mail to [log in to unmask]: SET 
> Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
> posts: send e-mail to [log in to unmask]: SET Technet Digest Search the 
> archives of previous posts at: http://listserv.ipc.org/archives Please

> visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
> for additional information, or contact Keach Sasamori at 
> [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0 To 
> unsubscribe, send a message to [log in to unmask] with following text in

> the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt 
> or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing 
> per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: 
> http://listserv.ipc.org/archives Please visit IPC web site 
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16for additional 
> information, or contact Keach Sasamori at [log in to unmask] or 
> 847-615-7100 ext.2815
> -----------------------------------------------------
>

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2