Based on past real time experience 2 hours min @ 250 worked for any type of
soldering being performed including HAL and the operation being done within
4 hours. I have baked rigid flex up to .25 thick at at 4-6 hrs but only
during the summer months.
Moisture being absorbed into the board is minimal but very important to
remove prior to any extreme heat. Kapton and acrylic adhesive is the
concern.
Thank you,
Jim Mahoney
Quick Turn Flex Circuits, LLC
Applications Project Manager
P# 603-821-6571
F# 603-821-5723
M# 603-305-6250
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Monday, June 23, 2008 3:21 PM
To: [log in to unmask]
Subject: Re: [TN] edge delamination flexible circuits assemblies
A bake of 250 F (126 C) for two hours could very well be just the right
bake time for a flex circuit.
The bake schedules listed in Handbook and J-STD-033 are guidelines, and
it is best if you determine the optimum bake schedule for any given flex
or PWB. I have detailed how this is done within this forum, check the
archives.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Monday, June 23, 2008 1:16 PM
To: [log in to unmask]
Subject: Re: [TN] edge delamination flexible circuits assemblies
A 2 hour bake is not what IPC recommends for rigid flex. HDBK-001 says a
minimum of 6. Regards Steve Kelly
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James Mahoney
Sent: June-23-08 1:06 PM
To: [log in to unmask]
Subject: Re: [TN] edge delamination flexible circuits assemblies
Without understanding the actual material being used it's difficult to
tell.
I would recommend cleaning with alcohol and bake prior to any assembly @
250 degrees for 2 hours and try and solder within 4 hours.
Thank you,
Jim Mahoney
Quick Turn Flex Circuits, LLC
Applications Project Manager
P# 603-821-6571
F# 603-821-5723
M# 603-305-6250
** This email and all attachments have been scanned prior to being
sent** Confidentiality Notice: This page and any accompanying documents
contain information that is confidential, privileged or exempt from
disclosure and is intended for the exclusive use of the addressee. If
you are not the intended recipient, you are hereby notified that any
disclosure, copying, distribution or use of the contents of this
information in any manner is strictly prohibited.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gabriela
Sent: Monday, June 23, 2008 1:11 PM
To: [log in to unmask]
Subject: [TN] edge delamination flexible circuits assemblies
What may cause the edge delamination of rigid/flex assemblies along the
edges of the flex connector?
We saw this defect only after cleaning the circuits in ABZOL .
Before assembly we are drying the circuits for several hours at 120C. Is
it possible that the cleaning process attacks the adhesive?
Are there recommendations for cleaning flexs?
Gaby
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