Certainly looks like vesication, either due to moisture in the 
compressed air (don't think that filters will remove it!) or hygroscopic 
material on the substrate or a combination of the two.

Brian

Steve Gregory wrote:
> Hi Kenny!
> 
> Picture is up! Go to:
> 
>  http://stevezeva.homestead.com/files/Bubbles.jpg
> 
> Steve
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Bloomquist
> Sent: Monday, June 02, 2008 11:58 AM
> To: [log in to unmask]
> Subject: Re: [TN] Tiny Bubbles
> 
> Woops, I forgot to mention that we spray coat these boards. The bubbles
> are most prevalent along thick edges but pretty much everywhere. I'll
> see if I can get Steve to post a picture.
> 
> Thanks,
> 
> KennyB
> 
> -----Original Message-----
> From: Kathy Kuhlow [mailto:[log in to unmask]]
> Sent: Monday, June 02, 2008 9:53 AM
> To: 'TechNet E-Mail Forum'; Ken Bloomquist
> Subject: RE: [TN] Tiny Bubbles
> 
> Are the air bubbles along component edges or open areas? It might be
> that you are moving the board in/out of the material too fast.  I know
> from a past project we needed to allow extra time during the dip prior
> to removal for the air bubble to release on SOT package devices. 
> 
> Kat
> 
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