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June 2008

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Subject:
From:
Ryan Grant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 23 Jun 2008 14:39:50 -0600
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Time and money.  You can place a lot of glue dots onto a board in a
matter of 20 seconds or less with a stencil and a cheap screen printer.


Of course, you reach a point of diminishing returns when only a handful
of glue dots are needed.  I tend to think of glue stencils as "old
school" since selective wave solder pallets have been around for ages...

Ryan
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of legg
Sent: Wednesday, June 18, 2008 9:42 AM
To: [log in to unmask]
Subject: Re: [TN] Glue Mask Requirements

Don't mean to side-track this thread, however this is the first time 
I've seen a reference to glue or epoxy masking.

My work has used spot adhesive despensing techniques for wave-
side and some other smd for some years on mixed technology power 
assemblies. This is not always specifically for retention purposes.

I'd have difficulty transferring knowledge accumulated using this 
method to masking. The very idea sounds incredibly messy - I'd 
even be tempted to use disposable stencils.

Any good references or reasons why masking is preferable?

Rob Legg
Power Electronics Specialists

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