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June 2008

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 23 Jun 2008 14:20:37 -0500
Content-Type:
text/plain
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text/plain (118 lines)
A bake of 250 F (126 C) for two hours could very well be just the right
bake time for a flex circuit.
The bake schedules listed in Handbook and J-STD-033 are guidelines, and
it is best if you determine the optimum bake schedule for any given flex
or PWB. I have detailed how this is done within this forum, check the
archives. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Monday, June 23, 2008 1:16 PM
To: [log in to unmask]
Subject: Re: [TN] edge delamination flexible circuits assemblies

A 2 hour bake is not what IPC recommends for rigid flex. HDBK-001 says a
minimum of 6. Regards Steve Kelly

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James Mahoney
Sent: June-23-08 1:06 PM
To: [log in to unmask]
Subject: Re: [TN] edge delamination flexible circuits assemblies

Without understanding the actual material being used it's difficult to
tell.
I would recommend cleaning with alcohol and bake prior to any assembly @
250 degrees for 2 hours and try and solder within 4 hours.

Thank you,
Jim Mahoney
Quick Turn Flex Circuits, LLC
Applications Project Manager
P# 603-821-6571
F# 603-821-5723
M# 603-305-6250


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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gabriela
Sent: Monday, June 23, 2008 1:11 PM
To: [log in to unmask]
Subject: [TN] edge delamination flexible circuits assemblies

What may cause the edge delamination of rigid/flex assemblies along the
edges of the flex connector?
We saw this defect only after cleaning the circuits in ABZOL .

Before assembly we are drying the circuits for several hours at 120C. Is
it possible that the cleaning process attacks the adhesive?

Are there recommendations for cleaning flexs?

Gaby


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