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June 2008

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Subject:
From:
Michelle Michelotti <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Michelle Michelotti <[log in to unmask]>
Date:
Mon, 23 Jun 2008 09:56:13 -0500
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Fundamentals of Printed Circuit Board Fabrication
Tuesday, July 15, 2008 - 8:30 am-5:00 pm
Maple Plain, MN

Advanced PWB Troubleshooting: Identification, Analysis and Prevention of Critical PWB Defects
Wednesday, July 16, 2008 - 8:30 am-12:00 pm
Maple Plain, MN

Via Hole Filling Technology and Processes: An Overview

Wednesday, July 16, 2008 - 1:30 pm-5:00 pm

Maple Plain, MN

Hosted by OMG Electronic Chemicals, Inc.

Registration Information:
*                  Register for all three workshops and save 10%!
*                  Early Registration - Register by June 27, 2008, and save an additional 10% off the prices shown below.
*                  Group Discount - Register three individuals from your company at the same time and receive the fourth registration FREE.

Register for these upcoming workshops by copying and pasting the following link into your web browser http://www.ipc.org/calendar/2008/FabWorkshopSeriesHostedbyOMG0708/FabWorkshop0708.htm.

For further information, please contact Michelle Michelotti at +1 847-597-2822 or via email at [log in to unmask]<mailto:[log in to unmask]>



Fundamentals of Printed Circuit Board Fabrication

Tuesday, July 15 - 8:30 am-5:00 pm

Maple Plain, MN

Workshop Instructor: Richard Snogren, Bristlecone LLC



About the course:

Will your job benefit if you have a clear and solid understanding of PCB technology? Are you ready to advance your career by expanding your capabilities and background? This course will help you build that foundation.  Classic printed circuit board, high density interconnects (HDI/microvia), and hybrid multilayer, flex and rigid flex printed circuit board technology will be explored.



Advanced PCB technologies and exotic interconnection structures, including HDI/microvia, hybrid constructions and materials and flex and rigid flex, will also be discussed.  This training program was created to start building a foundation of knowledge and understanding for the PCB user community including engineering, design, project management, materials, manufacturing, quality and procurement. It bridges the user's gap to PCB manufacturing, enabling the users to perform their jobs more effectively and benefit their organizations with quality improvements, cost savings and cycle time reductions.



Advanced PWB Troubleshooting: Identification, Analysis and Prevention of Critical PWB Defects

Wednesday, July 16 - 8:30 am-12:00 pm

Maple Plain, MN

Workshop Instructor: Michael Carano, OMG Electronic Chemicals



About the course:

This intense workshop will provide tools for advanced problem solving for printed circuit boards manufacturing. Defects such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away carry significant costs. Root cause of yield-reducing defects may not be readily apparent and multiple factors may contribute to them. This course will explore the most intricate of these factors and how they originate several process steps back, contributing to scrap product. Participants will learn how to recognize problems and take corrective action before it is too late. Solderability and assembly related issues such as outgassing and blow holes will also be reviewed. Participants should have some knowledge of the PCB fabrication process.



The course will conclude with a discussion on imaging, including liquid-photoimageable solder masks. Strategies to solve solder mask peeling, poor circuit trace coverage, skips, bubbles, and poor adhesion in nickel gold plating will be discussed in detail. Solder mask equipment and its effect on soldermask quality will also be explored.



Via Hole Filling Technology and Processes: An Overview

Wednesday, July 16 - 1:30 pm-5:00 pm

Maple Plain, MN

Workshop Instructor: Michael Carano, OMG Electronic Chemicals



About the course:

The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and processes that will enable the move towards sequential lamination, blind and buried vias, and via-in-pad technology.



Circuit board fabricators need to adopt techniques such as via filling capability for both blind and buried vias. The problem, of course, is that with many new technologies, fabricators and end-users are faced with a myriad of process technologies that they must choose from. This IPC workshop describes the technological drivers behind the need for via filling in a highly effective and reliable fashion for high density, high aspect ratio printed wiring boards. Close attention is paid to the use of these via filling materials for highly complex circuit designs.



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