Yes, too little P will allow the acidity of the gold bath to pit the
nickle surface. I think pitting is a better word. And I agree with
Werner's definition.
So what is the definition of Brittle Intermetallic Failure as opposed to
Black Pad? Or did I miss that?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Friday, June 20, 2008 3:05 AM
To: [log in to unmask]
Subject: Re: [TN] [LF] [TN] SN100 for Reflow Application
Hi Vladimir,
For BP I am really only concerned about the surface, so EDS is
fine--after all it is the interface surface that is weak.
Cavitation (as a ME that word bothers me because cavitation is what a
propeller does in water) is a sign of the P notdoing its job.
So I stand by my definition.
Werner Engelmaier
Future workshops:
Solder Joint Reliability: Parts 1 through 4, July 17/18, Thal,
Switzerland Pb-Free Soldering Processes-Survival, Quality, Reliability,
August 18, Orlando Reliability Issues with Lead-Free Soldering
Processes, September 22, Schaumburg Failure Mode and Root Cause Analyses
Reliability (Fatigue, Brittle Fracture, ENIG), September 22, Schaumburg
**************
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