Thank you everybody for providing more insight into this issue. I am doing some studies with different laminates, as well as pursuing the plating quality issue with the board house. Will keep everyone posted on the outcome.
Regards,
Amol
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir
Sent: Friday, June 20, 2008 10:03 AM
To: [log in to unmask]
Subject: Re: [TN] [LF] [TN] SN100 for Reflow Application
Hi Werner,
That is obviously your choice but I'd prefer to stick with mine :-)
I still think that BP and BF are two completely different phenomena and
the fact that BF occurs not just on ENIG boards, but with almost all
other finishes (of cause only for Pb-free solders) makes me think that
I'm right.
Be careful with using/interpreting EDS for fracture surfaces. It's NOT
that straight forward.
Regards,
Vladimir
________________________________
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Friday, June 20, 2008 4:05 AM
To: Igoshev, Vladimir; [log in to unmask]
Subject: Re: [TN] [LF] [TN] SN100 for Reflow Application
Hi Vladimir,
For BP I am really only concerned about the surface, so EDS is
fine--after all it is the interface surface that is weak.
Cavitation (as a ME that word bothers me because cavitation is what a
propeller does in water) is a sign of the P notdoing its job.
So I stand by my definition.
Werner Engelmaier
Future workshops:
Solder Joint Reliability: Parts 1 through 4, July 17/18, Thal,
Switzerland
Pb-Free Soldering Processes-Survival, Quality, Reliability, August 18,
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle
Fracture, ENIG), September 22, Schaumburg
**************
Gas prices getting you down? Search AOL Autos for fuel-efficient used
cars.
(http://autos.aol.com/used?ncid=aolaut00050000000007)
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