Yes, there is at least one issue: we have observed massive tombstoning 
happening with these components when soldered with SnPb. My explanation 
for the high tombstoning level: SAC plating melts above SnPb melting 
temperature in the sharp rise to peak temperature leading to a sudden change 
in wetting behavior of the component leads. As a result, an imbalance in 
temperature/timing between both passive's ends gives a high probability of 
tombstoning.

Geert Willems
IMEC

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