Can anyone give a brief description on finish plating of vias and the
factors effecting it?   Specifically, is it possible, impossible, or just
difficult to apply finish plating to blind and/or soldermask tented vias?
What are the negatives to tenting both sides of a via vs just one side?  We
have PCBs with .015" dia vias.  The vias are tented on one side w/
soldermask.  The other side terminates as via-in-pad.  Finish is ImAg.
Should these vias also exhibit ImAg or be exempt from it due to the tenting?
What are the pertinent IPC specs?

TIA,

 

Kevin Glidden

Manufacturing Engineer

Luminescent Systems Inc.


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------