Hi Vladimir,
So you have a problem with the BP definition of: "An interfacial separation
with the PCB/component-side fracture surface showing nickel and more than
5wt% of phosphorous and the other fracture surface attached to the solder volume
showing either SnNi/SnCuNi-IMC or solder and more than 5wt% of P."
This defines a P minimum, so when you see a problem with more P, it is
included.
You certainly can measure the P-content with various techniques—there is
nothing magic about 5 wt%, any substantial P-spike in EDS would suffice for the
definition.
So, I gave it a try—you do not like it [I do not know why?]—so now it is
your turn.
Werner Engelmaier
Future workshops:
Solder Joint Reliability: Parts 1 through 4, July 17/18, Thal, Switzerland
Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18,
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture,
ENIG), September 22, Schaumburg
**************
Gas prices getting you down? Search AOL Autos for
fuel-efficient used cars.
(http://autos.aol.com/used?ncid=aolaut00050000000007)
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