Hi Werner,



I definitly would. based on my experience, it's about the strength of the "interface", rather than the content of P. I saw boards with the P content above the limit you specified and I could take off the components with my fingers.



On top of it, I have no clue how to measure the P content with a conventional technique like EDS based on your definition. Do you?



Regards,



Vladimir



----- Original Message -----

From: [log in to unmask] <[log in to unmask]>

To: Igoshev, Vladimir; [log in to unmask] <[log in to unmask]>; [log in to unmask] <[log in to unmask]>

Sent: Thu Jun 19 17:30:04 2008

Subject: Re: [TN] [LF] [TN] SN100 for Reflow Application



Hi Vladimir,

Would you have a problem with defining BP as follows: An interfacial separation with the PCB/component-side fracture surface showing nickel and more than 5wt% of phosphorous and the other fracture surface attached to the solder volume showing either SnNi/SnCuNi-IMC or solder and more than 5wt% of P.



Werner Engelmaier

Future workshops:

Solder Joint Reliability: Parts 1 through 4, July 17/18, Thal, Switzerland

Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18, Orlando

Reliability Issues with Lead-Free Soldering Processes, September 22, Schaumburg

Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, ENIG), September 22, Schaumburg







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