Thanks a lot.

 

Vladimir

 

________________________________

From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Wednesday, June 18, 2008 4:53 PM
To: Igoshev, Vladimir; [log in to unmask]
Subject: Re: [TN] SN100 for Reflow Application

 

Hi Vladimir,
No IPC spec yet, but HP limits cooling rates for Pb-free to 1.5C/sec.

Werner Engelmaier
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, June 19, London
Interconnect Failures and Design for Reliability for PCB PTHs, June 19,
London
Solder Joint Reliability: Parts 1 through 4, July 17/18, Thal,
Switzerland
Pb-Free Soldering Processes-Survival, Quality, Reliability, August 18,
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle
Fracture, ENIG), September 22, Schaumburg



**************
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