Hi Werner,
Is there any spec where the cooling rate you mentioned being specified?
Thank you,
Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Tuesday, June 17, 2008 4:33 PM
To: [log in to unmask]
Subject: Re: [TN] SN100 for Reflow Application
Hi Amol,
High Sn solders do have lower creep rates, higher strengths, and higher
modulii of ductility relative to SnPb-this clearly contributes to the
problems you
observe. what you can do is slow down the cooling rates from reflow to
no more
than 1.5C/sec to avoid the thermal shock causing pad cratering and to
some
extent brittle interfacial failures.
The PCb material may also contribute-some of the LF-soldering capable
PCB
base materials are more brittle.
Werner Engelmaier
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, June 17, London
Interconnect Failures and Design for Reliability for PCB PTHs, June 17,
London
Solder Joint Reliability: Parts 1 through 4, July 17/18, Thal,
Switzerland
Pb-Free Soldering Processes-Survival, Quality, Reliability, August 18,
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle
Fracture,
ENIG), September 22, Schaumburg
**************
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fuel-efficient used cars.
(http://autos.aol.com/used?ncid=aolaut00050000000007)
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