Woops, I forgot to mention that we spray coat these boards. The bubbles are
most prevalent along thick edges but pretty much everywhere. I'll see if I
can get Steve to post a picture.

Thanks,

KennyB

-----Original Message-----
From: Kathy Kuhlow [mailto:[log in to unmask]] 
Sent: Monday, June 02, 2008 9:53 AM
To: 'TechNet E-Mail Forum'; Ken Bloomquist
Subject: RE: [TN] Tiny Bubbles

Are the air bubbles along component edges or open areas? It might be that
you are moving the board in/out of the material too fast.  I know from a
past project we needed to allow extra time during the dip prior to removal
for the air bubble to release on SOT package devices. 

Kat

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