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June 2008

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Subject:
From:
Michelle Michelotti <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Michelle Michelotti <[log in to unmask]>
Date:
Thu, 12 Jun 2008 09:04:30 -0500
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IPC Summer School Webcast Series: Back to the Basics

Design for Manufacture <http://www.ipc.org/calendar/2008/SummerSchoolWebcastSeries0708/SummerSchoolSeries.htm#Design>

July 1, 2008 - 10:00 am - 11:00 am<http://www.ipc.org/calendar/2008/SummerSchoolWebcastSeries0708/SummerSchoolSeries.htm#Design>

Basics of Base Materials <http://www.ipc.org/calendar/2008/SummerSchoolWebcastSeries0708/SummerSchoolSeries.htm#Materials>

July 10, 2008 - 10:00 am - 11:00 am<http://www.ipc.org/calendar/2008/SummerSchoolWebcastSeries0708/SummerSchoolSeries.htm#Materials>

Printed Board Processing <http://www.ipc.org/calendar/2008/SummerSchoolWebcastSeries0708/SummerSchoolSeries.htm#Processing>

July 17, 2008 - 10:00 -11:00 am<http://www.ipc.org/calendar/2008/SummerSchoolWebcastSeries0708/SummerSchoolSeries.htm#Processing>

Printed Board Troubleshooting <http://www.ipc.org/calendar/2008/SummerSchoolWebcastSeries0708/SummerSchoolSeries.htm#Troubleshooting>

July 24, 2008 - 10:00 am - 11:00 am<http://www.ipc.org/calendar/2008/SummerSchoolWebcastSeries0708/SummerSchoolSeries.htm#Troubleshooting>

Printed Circuit Board Test and Inspection <http://www.ipc.org/calendar/2008/SummerSchoolWebcastSeries0708/SummerSchoolSeries.htm#TestandInspection>

August 7, 2008 - 10:00 - 11:00 am <http://www.ipc.org/calendar/2008/SummerSchoolWebcastSeries0708/SummerSchoolSeries.htm#TestandInspection>

To register for theses informative webcasts, please go to http://www.ipc.org/calendar/2008/SummerSchoolWebcastSeries0708/SummerSchoolSeries.htm and register by June 23 to receive 10% off.
Design for Manufacture
July 1, 2008 - 10:00 am - 11:00 am
Webcast Instructor: Russell Nowland

About the webcast:
To design and manufacture electronics, it is essential to meet cost targets, product introduction windows, process and test yields reliability, environmental and product safety criteria. To achieve this it is imperative to have robust communication between all parties involved in the design and manufacture of the product. The best way to achieve this is to have a well established design For X (DFX) process such as "M" for manufacturing, "A" for Assembly, "E" for Environment, "T" for Testability, "R" for Reliability, "S" for Safety or Simplicity, etc. These and other factors need to be considered during the product design cycle.
This webcast will explain a of what makes up an effective DFX process concentrating primarily on Design For Manufacture (DFM) of printed circuit assemblies. It will also discuss how to effectively establish a DFM process in an OEM (Original Equipment Manufacturing) environment where you design and manufacture your own products, an OED (Original Equipment Designer) environment where you design your own products but outsource your manufacturing, and an environment where you outsource both design and manufacturing.
Basics of Base Materials
July 10, 2008 - 10:00 am - 11:00 am
Webcast Instructor: Doug Sober

About the webcast:
The workshop topic of discussion is laminate and prepreg materials with a special focus on their manufacture, properties and PCB application. All grades of base materials used in printed boards from low-cost, paper-based (FR-1) to polyimide are analyzed in this webcast. A special focus will be on lead-free and halogen-free materials.
Printed Board Processing
July 17, 2008 - 10:00 -11:00 am
Webcast Instructor: Michael Carano
About the webcast:
The printed circuit board fabrication process is an intricate maze of interrelated steps, both chemical and mechanical. A thorough understanding of each step from surface preparation to electroplating is necessary. Each step is critical to minimize or eliminate non-conforming defects, especially defects that increase costs and deter customers.
In this webcast, we will identify and explain the basics of printed circuit board fabrication with an emphasis on processes and materials. You will gain extensive practical knowledge in troubleshooting techniques. You'll learn how to identify the effects of up and down stream processes in the PCB fabrication process, while learning the latest in processing alternatives and quality control.
Printed Board Troubleshooting
July 24, 2008 - 10:00 am - 11:00 am
Webcast Instructor: Michael Carano

About the webcast:
This overview webcast will provide tools for advanced problem solving for printed circuit boards. Defects such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away carry significant costs. Root cause of yield-reducing defects may not be readily apparent and multiple factors may contribute to them. This webcast will explore the most intricate of these factors and how they originate several process steps back, contributing to scrap product. Participants will learn how to recognize problems and take corrective action before it is too late. Solderability and assembly related issues such as outgassing and blow holes will also be reviewed. Participants should have some knowledge of the PCB fabrication process.
The webcast will conclude with a discussion on imaging, including liquid-photoimageable solder masks. Strategies to solve solder mask peeling, poor circuit trace coverage, skips, bubbles, and poor adhesion in nickel gold plating will be discussed in detail. Solder mask equipment and its effect on soldermask quality will also be explored.
Printed Circuit Board Test and Inspection
August 7, 2008 - 10:00 - 11:00 am
Webcast Instructor: Stacy Johnson

About the webcast:
Printed circuit board test and Inspection is key to the success of any assembly situation. Attendees will learn about the different test and inspection methodologies and where they can be deployed, as well as what drives the need for test and inspection. Attendees will also explore the tradeoffs to consider when choosing an inspection strategy.



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