Hello,
          I am getting some conflicting answers about the minimum thru via size for .062" thick board class 3.
The IPC -2222 spec 9.2.2.3 specifies Minimum Drilled Hole size for Plated thru hole Vias for class 3 as .012"
For board thickness .062".
From other sources I heard that class 3 could have 8 mil drill as long as the annular ring 1 mil internal and 2 mil external
Is maintained.
Any inputs on this matter are appreciated

Mirka

Mirka Halas | PCB Designer, Librarian | EuroTech Inc | O: +1 800.541.2003 x101
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