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June 2008

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Subject:
From:
- bogert <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, - bogert <[log in to unmask]>
Date:
Sun, 8 Jun 2008 15:06:14 -0400
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On new drawings have engineering add a note to the BOM for each part that is 
moisure sensitive.  At receiving inspection add instructions to folks to 
leave moisture sensitive parts in the original bags until they are dispersed 
to the floor.


>From: "Juan T. Marugán" <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>,              "Juan T. 
>Marugán" <[log in to unmask]>
>To: [log in to unmask]
>Subject: [TN] Moisture sensitive componentes & manufacturing documentation
>Date: Thu, 29 May 2008 05:19:46 -0500
>
>Good morning ALL from Spain.
>
>We are starting to use moisture sensitive components in our boards (class 
>3).
>
>It is clear that these components shall be handled iaw J-STD-033, but we
>have a concern: how to point out in the manufacturing documentation that
>there are moisture sensitive components in the PWA. This information is
>essential to the process engineering people to prepare the manufacturing
>instruction sheets.
>
>In a first approach, we have thought to introduce a warning note in the
>drawing, but we are not sure if it is a standard practice.
>
>If you can send your comments, I’ll appreciate it a lot.
>
>Muchas gracias.
>
>Juan T. Marugán
>Indra Sistemas SA
>Supply Chain Management (SCM)
>Madrid (ESPAŃA)
>
>
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