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Date: | Fri, 13 Jun 2008 20:40:40 +0800 |
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Kevin,
Pls also consider whether there is some contaminant to dissolve from board
into the flux tank. For example, silicon-containing compounds may inhibit
the foaming properties of the flux
Jackson Chan
Techncial Services Manager
Cookson Electronics - Alpha Metals
(Low cost, high reliability alloy - SACX0807)
"Liang, Kevin"
<kevin.liang@TYCO
ELECTRONICS.COM> To
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Subject
2008/06/12 下午 [TGA] Flux issue
04:21
Please respond to
Asia Committe
Task Group Forum
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Please respond to
"Liang, Kevin"
<kevin.liang@TYCO
ELECTRONICS.COM>
All,
我们公司最近波烽焊工序出了点问题,就是松香不能正常发泡,表现为松香在刚开始
使用的时候发泡很正常,但用了一两个小时之后发泡就不均匀、发泡很大.异致PCB板
经过预热后松香不能很好的挥发,残余松香附在触点上,后工序出现高不良.
请问如何解决此问题?如果分析松香是否有问题,可以从哪些方面入手?
Best regards,
Kevin Liang 梁益健
QA Supervisor
Tyco Electronics
Dongguan Transpower Electronic Products Co. Ltd
Jinxin Industrial Area, Jinmei, Changping Town
Dongguan, Guangdong, China.
Postal Code: 523579
86 769 83335747-343 Tel
86 769 83335746 Fax
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