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June 2008

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Subject:
From:
Jackson Chan <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Jackson Chan <[log in to unmask]>
Date:
Fri, 13 Jun 2008 20:40:40 +0800
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Kevin,



Pls also consider whether there is some contaminant to dissolve from board

into the flux tank.  For example, silicon-containing compounds may inhibit

the foaming properties of the flux



Jackson Chan

Techncial Services Manager



Cookson Electronics - Alpha Metals

(Low cost, high reliability alloy - SACX0807)





                                                                           

             "Liang, Kevin"                                                

             <kevin.liang@TYCO                                             

             ELECTRONICS.COM>                                           To 

             Sent by: TGAsia           [log in to unmask]                      

             <[log in to unmask]>                                           cc 

                                                                           

                                                                   Subject 

             2008/06/12 下午           [TGA] Flux issue                    

             04:21                                                         

                                                                           

                                                                           

             Please respond to                                             

               Asia Committe                                               

             Task Group Forum                                              

             <[log in to unmask]>;                                             

             Please respond to                                             

              "Liang, Kevin"                                               

             <kevin.liang@TYCO                                             

             ELECTRONICS.COM>                                              

                                                                           

                                                                           









All,



我们公司最近波烽焊工序出了点问题,就是松香不能正常发泡,表现为松香在刚开始

使用的时候发泡很正常,但用了一两个小时之后发泡就不均匀、发泡很大.异致PCB板

经过预热后松香不能很好的挥发,残余松香附在触点上,后工序出现高不良.



请问如何解决此问题?如果分析松香是否有问题,可以从哪些方面入手?



Best regards,

Kevin Liang 梁益健

QA Supervisor

Tyco Electronics

Dongguan       Transpower       Electronic       Products      Co.      Ltd

Jinxin       Industrial       Area,       Jinmei,       Changping      Town

Dongguan,                         Guangdong,                         China.

Postal                             Code:                             523579

86                   769                  83335747-343                  Tel

86                    769                    83335746                   Fax

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