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Date: | Wed, 25 Jun 2008 14:23:23 +0800 |
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我申请参加
如有任何意见和建议,请和我联系!
谢谢!
Charlotte Hao
<[log in to unmask]>
发件人: TGAsia 收件人
<[log in to unmask]> [log in to unmask]
抄送
2008-06-25 11:20 主题
[TGA] 答复: 诚邀您加入
1-13CN(IPC-7351)! Welcome you
请答复 给 to join 1-13CN(IPC-7351)!
Asia Committe
Task Group Forum
<[log in to unmask]>;
请答复 给
Charlotte Hao
<[log in to unmask]>
邀请函
----1-13CN 技术组招募成员
继D-31bCN后,又一个有关组装行业设计领域的技术组——1-13CN正式问鼎IPC
TGAsia。
1-13CN是关于表面贴装元器件所用焊盘设计的技术组,它主要专注于IPC-7351A
即:表面贴装设计及连接盘图形标准的通用要求,即在设计阶段就要考虑表面贴装连
接盘的大小、形状及公差,以保证在组装过程中能够形成适当的焊点,从而满足
J-STD-001的要求及检验、测试及返工的要求。
该技术组将首先翻译、审核、出版该标准的中文版标准,并与美国的技术组共同审
核、更新这项标准。
来自华为技术有限公司的黄文强担任1-13CN的主席。
诚邀更多的技术人员及专家踊跃加入1-13CN!
联系人:郝 宇: [log in to unmask];电话:13692293633
黄文强: [log in to unmask]
Invitation
1-13CN is recruiting members
Another technical group 1-13CN, which is the one on design field of
electronic industry, has launched in IPC TGAsia after D-31bCN.
1-13CN is a group on land pattern geometries used for the surface
attachment of electronic components. It is focusing on IPC-7351A Generic
Requirements for Surface Mount Design and Land Pattern Standard. The
intent of the document is to provide the appropriate size, shape and
tolerance of surface mount land patterns to insure sufficient area for the
appropriate solder fillet to meet the requirements of IPC J-STD- 001, and
also to allow for inspection, testing, and rework of those solder joints
At first, the group will translate and review the document into Chinese,
at the same time, it will develop and update its new versions together
with 1-13CN in USA.
Johnny Huang undertakes the Chairman of 1-13CN, who is from Huawei.
More technicians and experts are sincerely welcome to join 1-13CN!
Please contact with Charlotte Hao: [log in to unmask],
Mobil:13692293633
Johnny Huang: [log in to unmask]
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