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June 2008

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Subject:
Board support system
From:
Jackson Chan <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Jackson Chan <[log in to unmask]>
Date:
Sun, 22 Jun 2008 12:00:18 +0800
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (674 bytes) , pic28253.gif (204 bytes) , pic06868.gif (34 kB) , pic25547.gif (54 kB) 

Dear all,

This is the question about the board support.
It is "VacuNest" system (see pictures below) from a company called
Novatec-eap (www.novatec-eap.com)? or similar support from other company ?
It is the type of cushion effect.  Do you have the experience to use this
type of support ?  Any advantages or disadvantages ?  How about the effect
of reliability of the solder joints on the bottomside components when
printing on the top surface of the board.

Jackson
(Embedded image moved to file: pic28253.gif)(Embedded image moved to file:
pic06868.gif)

       Step 1                           Step 2
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