Can anyone give a brief description on finish plating of vias and the
factors effecting it? Specifically, is it possible, impossible, or just
difficult to apply finish plating to blind and/or soldermask tented vias?
What are the negatives to tenting both sides of a via vs just one side? We
have PCBs with .015" dia vias. The vias are tented on one side w/
soldermask. The other side terminates as via-in-pad. Finish is ImAg.
Should these vias also exhibit ImAg or be exempt from it due to the tenting?
What are the pertinent IPC specs?
TIA,
Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.
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