All,
IPC-6012A with amendment 1, section 3.5.1, Conductor Width and Thickness
states, "When not specified on the master drawing the minimum conductor
width shall be 80% of the conductor pattern supplied in the procurement
documentation". The PCB suppliers interpret this to mean that BGA pads
for example can be 80% of the pad diameter specified in the procurement
documentation, which is the GERBER files unless specified otherwise and
still be acceptable per IPC-6012.
I am interested to hear how other users handle allowable reductions in
BGA pad size from that specified in the procurement documentation.
thanks
Best Regards,
-joe
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