Hi, Ben
Good question. I checked with the Power PC data sheets
http://ieeexplore.ieee.org/iel3/3906/11336/00514354.pdf?arnumber=514354
and they do not specify how they attach their 90/10 balls to the
package, but I suspect some type of high-temp alloy is used. I do not
believe they reflow the balls directly to the package pads. But I never
did know what they use to solder the balls to the package with. Let me
know if you find out.
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Tuesday, June 24, 2008 12:42 PM
To: [log in to unmask]
Subject: [TN] SAC solder on Pb90Sn10

Technetters,

Does anyone have any experience (or heard of) using SAC solder to attach
high-temp (Pb90Sn10) solder balls to a ceramic BGA?

Ben


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