In IPC-A-610D - 7.5.4 (also J-STD-001D - 6.1.3) , there is a brief discussion 
on Supported Holes - Wire/Lead Clinches.

This discusses the clinching of through-hole component leads, and the minimum 
bend, as documented in J-STD-001 is 45-degrees.


This corresponds to the section in NASA's NASA-STD-8739.3 - 8.5.2 - which 
also discusses Clinched Terminations. They give a Lead Bend of 75 to 90-
degrees.



We have a situation where we are doing 'Retention' of the leads... not 
clinching. This corresponds to NASA's 8.5.3 - which allows for the leads to 
be bent up to 30-degrees.

I am not able to locate the corresponding section in IPC that discusses 'lead 
retention'. 

Where in IPC's documentation would I locate a discussion for Lead Retention?

Thanks!

Regards,

James Jackson

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