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May 2008

TechNet@IPC.ORG

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Wed, 7 May 2008 20:04:42 -0400
Content-Type:
text/plain
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text/plain (91 lines)
THX
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed May 07 19:45:48 2008
Subject: Re: [TN] j-std-002A

1.3.1 Tests with Established Accept/Reject Criterion
Test A - Solder Bath/Dip and Look Test (Leaded Components
and Stranded Wire)
Test B - Solder Bath/Dip and Look Test (Leadless Components)
Test C - Wrapped Wire Test (Lugs, Tabs, Hooked Leads,
and Turrets)
Test D - Resistance to Dissolution/Dewetting of Metallization
Test
Test S - Surface Mount Process Simulation Test
1.3.2 Test without Established Accept/Reject Criterion
Test E - Wetting Balance Test (Leaded Components)
Test F - Wetting Balance Test (Leadless Components)
These methods are included for evaluation purposes only.
Data collected should be submitted to the IPC-Wetting Balance
Task Group for correlation and analysis.

 
 
John Burke
 
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Wednesday, May 07, 2008 3:05 PM
To: [log in to unmask]
Subject: [TN] j-std-002A

Help!  Does anyone still have an old j-std-002A?  Which solderability
test method quoted? Thank you in advance.
Best regards,
                           Joyce Koo

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