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Date: | Sat, 3 May 2008 10:25:48 -0700 |
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Applying this std to 100% leads sometimes to absurdity, in my opinion. Some
components are gold flashed and delivered on reels. What do yo do then? I
the used solder amount is large vs the gold, you will probably get such low
a gold w% that the risk of brittle gold/tin is negligible.I think a sound
decision based on a study of the resulting solder joint is quite
acceptable. Given that you have people with knowhow. It\s not forbidden to
use your brain....not yet...
Inge
----- Original Message -----
From: "David Reed" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, April 30, 2008 7:29 AM
Subject: [TN] IPC-J-STD-001D @ 3.9.3 GOLD REMOVAL
Recently a customer asked the following question.
Here is his question.
I do have a question of interpretation for you regarding "gold removal".
In section 3.9.3 it states that ".....95% of the surface to be solder
....."
needs to have gold removed. Failing to achieve the 95% is considered a
class
3 defect.
We are having boards with PIH gold plated leads rejected for not meeting
this
requirement.
Part of the problem is making the determination as to where and how the 95%
is measured.
Can you clarify for us exactly where the 95% is measured on the lead.
Before I reply to this engineer I thought to see if you had any input.
Thanks,
Dave
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