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May 2008

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TechNet E-Mail Forum <[log in to unmask]>, Inge <[log in to unmask]>
Date:
Sat, 3 May 2008 10:25:48 -0700
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Applying this std to 100% leads sometimes to absurdity, in my opinion. Some
components are gold flashed and delivered on reels. What do yo do then? I
the used solder amount is large vs the gold, you will probably get such low
a gold w% that the risk of brittle gold/tin is negligible.I think a sound
decision based on a study of  the resulting solder joint is quite
acceptable. Given that you have people with knowhow. It\s not forbidden to
use your brain....not yet...

Inge


----- Original Message ----- 
From: "David Reed" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, April 30, 2008 7:29 AM
Subject: [TN] IPC-J-STD-001D @ 3.9.3 GOLD REMOVAL


Recently a customer asked the following question.
Here is his question.

 I do have a question of interpretation for you regarding "gold removal".
In section 3.9.3 it states that ".....95% of the surface to be solder
....."
needs to have gold removed.  Failing to achieve the 95% is considered a
class
3 defect.

We are having boards with PIH gold plated leads rejected for not meeting
this
requirement.

Part of the problem is making the determination as to where and how the 95%
is measured.

Can you clarify for us exactly where the 95% is measured on the lead.

Before I reply to this engineer I thought to see if you had any input.


Thanks,
Dave

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