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May 2008

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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Fri, 30 May 2008 08:13:50 +0200
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text/plain
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text/plain (36 lines)
the whole world seems to be more or less mismatched..
Inge

________________________________

From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: den 29 maj 2008 13:53
To: Hernefjord Ingemar; [log in to unmask]
Subject: Re: [TN] via placement in LTCC


Hi Inge,
You have a case of 'local thermal expansion mismatch' between the solder
itself and whatever it is attached to.



Werner



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