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May 2008

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Subject:
From:
"Thayer, Wayne" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Thayer, Wayne
Date:
Thu, 29 May 2008 22:37:18 -0400
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Be advised that conductive adhesives were first considered for ROHS applications (1997-1999).  The results of tests were too inconsistent to suggest that reliable products would result.  Big problem was finding something to stick to tin or untreated copper reliably.  I don't think ENIG worked out either.  I gave up trying to glue down tin plated parts even on alumina which is an excellent thermal match for ceramic caps and thick film resistors.
 
So the record is that they are all EXTREMELY re-workable.  The workhorse of the ceramic chip&wire industry is Epotek H20E, which is available as a 2 part snap cure (5min at 150C) product.  You can pay a mixing/packing contractor to load it for you into syringes for dispense.  These need to be stored at -40C.
 
Wayne Thayer

________________________________

From: TechNet on behalf of Stadem, Richard D.
Sent: Thu 5/29/2008 1:53 PM
To: [log in to unmask]
Subject: Re: [TN] Dispensable Conductive Adhesive



Sorry, the Zymet TC 201P is not electrically conductive, only thermally,
but Zymet makes another product that is formulated just for that
application that is electrically conductive. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Alan Kreplick
Sent: Thursday, May 29, 2008 12:04 PM
To: [log in to unmask]
Subject: [TN] Dispensable Conductive Adhesive

Technetters,

Looking for a dispensable conductive adhesive to bond an RF shield/cover
to a trace area on the board.  Would like to find something that is
easily reworkable if components under the shield need to be replaced.

Any recommendations?

thanks

Al Kreplick
Sr. Manufacturing Engineer
Circuit Card Assembly
Air-toAir/Precision Strike/Land Combat
Raytheon Integrated Defense Systems
978-470-9931office
978-245-1702 pager
978-470-4307 fax
[log in to unmask] 


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