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May 2008

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Thu, 29 May 2008 12:27:32 -0500
Content-Type:
text/plain
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text/plain (63 lines)
Hi Al!

While I haven't used this material for your specific application, I have
used this material in another appplication that I can't talk openly
about, but might be a candidate for you:

http://www.epotek.com/SSCDocs/datasheets/H20E.PDF

It provides for a very good electrical bond, mecahnical bond is very
robust, and can be reworked.

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Alan Kreplick
Sent: Thursday, May 29, 2008 12:04 PM
To: [log in to unmask]
Subject: [TN] Dispensable Conductive Adhesive

Technetters,

Looking for a dispensable conductive adhesive to bond an RF shield/cover
to a trace area on the board.  Would like to find something that is
easily reworkable if components under the shield need to be replaced. 

Any recommendations?

thanks

Al Kreplick
Sr. Manufacturing Engineer
Circuit Card Assembly
Air-toAir/Precision Strike/Land Combat
Raytheon Integrated Defense Systems
978-470-9931office
978-245-1702 pager
978-470-4307 fax
[log in to unmask]  


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