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From:
"Nowland, Russell Howard (Russell)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Nowland, Russell Howard (Russell)
Date:
Thu, 29 May 2008 08:39:32 -0500
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Juan,

I am surprised you made it this long without having to handle MSD's.  Properly establishing a MSD process is not easy.  It takes a lot of documentation and most importantly operator training.

I fail almost everybody I audit initially.  To have a robust process it has to go all the way back to your ordering system and component databases.  Then you have to document and train material receiving, incoming inspection, warehouse, kitting, SMT, and repair. You have to know how to handle two-sided assemblies with MSD on the first side processed.  Adding notes to an assembly drawing would never pass a compliance audit.  

I agree with Kathy Kuhlow's comments.  If you deal with the component OEM's you are generally okay and 99.9% of the time you will receive material in good condition.  HOWEVER, if you deal with component brokers beware.  You never know what you will get.

You will also have equipment to consider like dry boxes, ovens, MBB (Moisture Barrier Bags) vacuum/sealing equipment.  Expendables like MBB's, desiccant and HIC cards. 

It is also important to understand that component other than integrated circuits have MSL.  A prime example that is often overlooked is tantalums.  They are typically MSL 3's.  

I am not in the business of advertising but Cogiscan has some good general knowledge documents on there website www.cogiscan.com under their "Knowledge Center".

Good luck, you have a lot to consider.

Russell Nowland
Alcatel-Lucent           
Advanced Manufacturing Engineer
Address: 14000 Quail Spring Parkway, Suite 300
Oklahoma City, OK 73134
email: [log in to unmask]
Desk: 405-302-1660
Cell: 405-203-0034
Fax: 405-302-1622
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Juan T. Marugán
Sent: Thursday, May 29, 2008 5:20 AM
To: [log in to unmask]
Subject: [TN] Moisture sensitive componentes & manufacturing documentation

Good morning ALL from Spain.

We are starting to use moisture sensitive components in our boards (class 3).

It is clear that these components shall be handled iaw J-STD-033, but we 
have a concern: how to point out in the manufacturing documentation that 
there are moisture sensitive components in the PWA. This information is 
essential to the process engineering people to prepare the manufacturing 
instruction sheets.

In a first approach, we have thought to introduce a warning note in the 
drawing, but we are not sure if it is a standard practice.

If you can send your comments, I'll appreciate it a lot.

Muchas gracias.

Juan T. Marugán 
Indra Sistemas SA
Supply Chain Management (SCM)
Madrid (ESPAŃA)
 

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