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May 2008

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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Thu, 29 May 2008 13:54:22 +0200
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text/plain
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text/plain (76 lines)
Did you spill my pint? 120 dB minimum. 

-----Original Message-----
From: Joyce Koo [mailto:[log in to unmask]] 
Sent: den 29 maj 2008 12:23
To: [log in to unmask]; Hernefjord Ingemar
Subject: Re: [TN] via placement in LTCC

Co ax?
--------------------------
Sent using BlackBerry


----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu May 29 05:58:43 2008
Subject: [TN] via placement in LTCC

 
Mr Trikeman or someone else with one foot in LTCC, need advice.

Imagine a 90 degree SMA coax connector for solder mounting on LTCC
silver thickfilm pads.
The RF connector center pin is soldered to a circular thickfilm pad,
that is double the diameter of the  RF connector center pin.

Now, these pads communicate by means of vias in the blue tape (the
dielectric). First, the vias were placed in the center of the circular
thickfilm pad, later, someone decided to move the via to the periphery,
i.e. off center. The designer has added a small land (ear)to the
circular thickfilm pad, and it's here the vias are removed.

The later design has caused some trouble. Seems as the off-center via
placement wasn't good.
I got some ideas what it's all about, but first I would like to hear
with  you, guys

Hope my description is understandable.

Inge 

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