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May 2008

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Subject:
From:
Paul Reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Reid <[log in to unmask]>
Date:
Fri, 2 May 2008 16:03:08 -0400
Content-Type:
text/plain
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text/plain (135 lines)
All this because Bev has RIM voids. 

Why is a mouse when it spins on it's tail?
Would you rather walk to work or carry a lunch?
What would you rather do or drag a board (PCB)?
When is a tree?
All generalities are false (including this one)!

I will by galumphing off for the weekend soon.

PR

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dwight Mattix
Sent: Friday, May 02, 2008 2:53 PM
To: [log in to unmask]
Subject: Re: [TN] Voids in internal PCB microvias

When you can snatch the pebble from my hand I will give you a serious
response (on a friday).

At 11:22 AM 5/2/2008, Paul Reid wrote:
>Hi Bev,
>
>Backfire ... by all means.
>
>Your subject line says "Voids in internal PCB microvias"
>
>Your customer wants to know the composition of a void in a buried 
>microvia.
>
>I think what you have posted is a PCB koan. A classic koan by Hakuin is

>"You know the sound of two hands clapping. What is the sound of one 
>hand clapping"
>
>PCB koan - "You know the composition of what fills a filled microvia.
>What is the composition of what fills a voided microvia?"
>
>The important part of the microvia is the part where there is no 
>microvia because that's the part that contains the void.
>
>This is the yin and yang of the what is, and what is not, in a
microvia.
>
>
>Grasshopper, this is the Tao of PCBs.
>
>Paul Reid, PCB Inc.
>
>PS. I would just look at the RIM of the void.
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
>Sent: Friday, May 02, 2008 12:54 PM
>To: [log in to unmask]
>Subject: [TN] Voids in internal PCB microvias
>
>TechNetters,
>I have a customer who wants to know the composition of any materials 
>(if
>any) inside copper plated internal microvias.  Obviously traditional 
>x-sectioning would lead to contamination by the x-sectioning process.
>Someone suggested laser cutting, but that is ridiculous, for the same 
>reason.  Someone else suggested FIB, but this is fiendishly expensive, 
>especially for the kind of depth of cut we might be talking about here.
>
>Any and all non-Friday afternoon suggestions welcome.
>(This last statement will probably backfire on me!) Bev RIM
>
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